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【English Market Research Report】Global Market for Semiconductor and IC Packaging Materials

【English Market Research Report】Global Market for Semiconductor and IC Packaging Materials

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The market size for semiconductor and IC packaging materials is projected to expand from 43.9 billion USD in 2024 to 70.9 billion USD by 2029, growing at a CAGR of 10.1%. This report investigates the global semiconductor and IC packaging materials market, summarizing trends by type, packaging technology, end-use industry, region, and profiles of companies entering the market.

  • Other services
  • Semiconductor packaging materials

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8/5 Webセミナー　半導体パッケージング技術講座

8/5 Webセミナー　半導体パッケージング技術講座

半導体パッケージの進化と樹脂封止技術を体系的に学ぶ。狭間隔バンプ対応や実装課題を解説

■タイトル 「半導体の進化による接合構造の変化とパッケージング対応 ～ 接合部の箇所数増および狭間隔化への樹脂封止技術の対応 ～」 高集積化・高密度化・3次元化が進む半導体パッケージでは、接合部（バンプ）の増加や狭ピッチ化への対応が重要な課題となっています。本セミナーでは、半導体パッケージの進化に伴う接合構造の変化を整理し、樹脂封止技術や実装技術の最新動向、課題と対策について実務経験豊富な講師が解説します。 【セミナーで得られる知識】 ・半導体PKGの開発経緯と最新動向 ・接合構造の変化とパッケージング技術 ・樹脂封止材料・封止技術の評価方法 ・狭間隔バンプへの封止技術と信頼性向上 ・先端パッケージングの課題と対策 【対象】 半導体関連企業の技術者・研究者・営業担当者、半導体製造・実装・封止材料・パッケージング技術に携わる方。

  • Other semiconductors
  • Other electronic parts
  • Technical Seminar
  • Semiconductor packaging materials

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